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<\/span><\/strong> \r \r銅箔生產(chǎn)<\/span><\/strong><\/span><\/span>\r<\/p>\r\r電解銅箔生產(chǎn)過程是先將電解銅氧化，制得硫酸銅溶液，然后在生箔機中電解生成生箔，生箔經(jīng)過酸洗、粗化、固化、鍍黃銅后處理過程而制得成品。它包括電解和電鍍兩大過程。例如，某銅箔生產(chǎn)公司工藝條件：硫酸濃度為<\/strong><\/span>120g/L<\/strong><\/span>、<\/strong><\/span>7-9KA/m2<\/strong><\/span>、陰陽極間隙為<\/strong><\/span>12mm<\/strong><\/span>。使用<\/strong><\/span>IrTa<\/strong><\/span>陽極可滿足生產(chǎn)要求，解決生產(chǎn)電流密度極高的問題。它采用部分浸在硫酸銅溶液中不斷旋轉(zhuǎn)的金屬輥筒為陰極，連續(xù)電解產(chǎn)生箔材。電解銅箔作為導電材料用在單面印刷電路板上，用量日益增加，厚度越來越薄，從厚度<\/strong><\/span>0.15mm<\/strong><\/span>、<\/strong><\/span>0.105mm<\/strong><\/span>、<\/strong><\/span> <\/span>0.07mm<\/strong><\/span>、<\/strong><\/span>0.05mm<\/strong><\/span>、<\/strong><\/span>0.035mm<\/strong><\/span>。<\/span><\/strong><\/span><\/span>\r<\/p>\r\r電解銅箔，根據(jù)厚度，可分為<\/strong><\/span>105um<\/strong><\/span>，<\/strong><\/span>70um<\/strong><\/span>，<\/strong><\/span>18um<\/strong><\/span>，<\/strong><\/span>12um<\/strong><\/span>，<\/strong><\/span>9um<\/strong><\/span>，以及<\/strong><\/span>5um<\/strong><\/span>等幾種，其中<\/strong><\/span>12um<\/strong><\/span>以及<\/strong><\/span>12um<\/strong><\/span>以下一般稱為超薄銅箔。<\/span><\/strong><\/span><\/span>\r<\/p>\r\r按照表面處理工藝，銅箔可分為粉色箔（表面鍍銅）、灰化箔（表面鍍鋅）、黃化箔（表面鍍黃銅）等幾種類型。<\/span><\/strong><\/span><\/span>\r<\/p>\r\rIPc<\/strong><\/span>標準根據(jù)電解銅箔的性能將其分為標準箔（<\/strong><\/span>STD<\/strong><\/span>——<\/strong><\/span>E<\/strong><\/span>類），高延箔（<\/strong><\/span>HD<\/strong><\/span>——<\/strong><\/span>E<\/strong><\/span>類），高溫高延箔（<\/strong><\/span>THE<\/strong><\/span>——<\/strong><\/span> <\/span>E<\/strong><\/span>類）及退火電解銅箔（<\/strong><\/span>ANN<\/strong><\/span>——<\/strong><\/span> <\/span>E<\/strong><\/span>類），可低溫退火電解銅箔（<\/strong><\/span>LTA<\/strong><\/span>——<\/strong><\/span>E<\/strong><\/span>類），可退火電解銅箔（<\/strong><\/span>A<\/strong><\/span>——<\/strong><\/span>E<\/strong><\/span>類）等幾大類。<\/span><\/strong><\/span><\/span>\r<\/p>\r\r日本在制造印刷電路板用銅箔通過硫酸銅溶液電解來制造，在直徑<\/strong><\/span>1-2<\/strong><\/span>米，高<\/strong><\/span>2-3<\/strong><\/span>米的鈦制旋轉(zhuǎn)圓筒陰極上鍍銅，在轉(zhuǎn)筒的一端剝離銅箔。在知道印刷電路用銅箔時的涂層鈦陽極，高度越約<\/strong><\/span>1.3<\/strong><\/span>米，區(qū)面長度約<\/strong><\/span>2.4<\/strong><\/span>米，板厚約<\/strong><\/span>25mm<\/strong><\/span>。用鈦基涂層陽極，板間距不用調(diào)整，陽極產(chǎn)生的氧氣泡激烈攪拌電解液，加速銅離子向陰極表面移動。因此，操作電流密度可加大到<\/strong><\/span>50A/dm2<\/strong><\/span>，從而顯著提高了電解槽的生產(chǎn)率。用熱分解法在鈦基體上涂敷<\/strong><\/span>IRO2<\/strong><\/span>涂層，在這種介質(zhì)條件下能很好地工作。設置極薄的鍍鉑中間層后，可防止鈦基體氧化，陽極壽命至少達到<\/strong><\/span>2.5<\/strong><\/span>年。<\/span><\/strong><\/span><\/span>\r<\/p>\r\r<\/span>\r<\/p>\r\r種類<\/span><\/strong>:<\/strong><\/span><\/span>\r<\/p>\r\r釕銥陽極板，銥鉭陽極板<\/strong><\/span> <\/strong><\/span><\/span>\r<\/p>\r\r<\/span>\r<\/p>\r\r應用<\/span><\/strong>: <\/strong><\/span><\/span>\r<\/p>\r\r銅箔生產(chǎn)<\/span><\/strong><\/span><\/span>\r<\/p>\r\r<\/span>\r<\/p>\r\r優(yōu)點<\/span><\/strong>:<\/strong><\/span><\/span>\r<\/p>\r\r極間距穩(wěn)定，可提高生產(chǎn)能力，承載電流高，電流分布均勻，銅箔上無污染，能耗低，工作時間長，安裝簡易<\/strong><\/span><\/span>\r<\/p>\r\r<\/span>\r<\/p>\r\r技術咨詢：葉生<\/span><\/strong> 13902945492<\/strong><\/span><\/span>\r<\/p><\/div>
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