| 潔馳PCB電鍍用鈦電極 |
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價格：500000 元(人民幣) | 產(chǎn)地：本地 |
| 最少起訂量：1 | 發(fā)貨地：本地至全國 | |
| 上架時間：2020-01-01 19:14:31 | 瀏覽量：21 | |
深圳市潔馳科技有限公司
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| 經(jīng)營模式：其他 | 公司類型：生產(chǎn)型 | |
| 所屬行業(yè)：電極 | 主要客戶：全國 | |
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| 聯(lián)系人:葉林 () | 手機:13902945492 |
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| 郵箱: | 地址:中國廣東省深圳市寶安區(qū) 寶安福永大洋路華豐物流產(chǎn)業(yè)園3棟 |
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<\/strong><\/span> \r \rPCB<\/strong><\/span>鍍銅<\/strong><\/span><\/span><\/span>\r<\/p>\r \r酸性電解鍍銅在印刷線路板孔金屬化工藝中是一個重要環(huán)節(jié)。隨著微電子技術(shù)的飛速發(fā)展，印制電路板制造向多層化、積層化、功能化和集成化方向迅速的發(fā)展。促使印制電路設(shè)計大量采用微小孔、窄間距、細導(dǎo)線進行電路圖形的構(gòu)思和設(shè)計，使得印制電路板制造技術(shù)難度更高，特別是多層板通孔的縱橫比超過<\/strong><\/span>5:1<\/strong><\/span>及積層板中大量采用的較深的盲孔，使常規(guī)的垂直電鍍工藝不能滿足高質(zhì)量、高可靠性互連孔的技術(shù)要求，于是產(chǎn)生水平電鍍技術(shù)。<\/strong><\/span><\/span><\/span>\r<\/p>\r \r<\/span>\r<\/p>\r \r1<\/strong><\/span>．<\/strong><\/span>PCB<\/strong><\/span>水平反向脈沖鍍銅<\/strong><\/span><\/span><\/span>\r<\/p>\r \r由于線路板的設(shè)計要求趨向于細線徑、高密度、細孔徑<\/strong><\/span>(<\/strong><\/span>高的深徑比，甚至微通孔<\/strong><\/span>)<\/strong><\/span>、填盲孔，傳統(tǒng)的直流電鍍變得越來越不能達到要求，尤其在通孔電鍍的孔徑中心的鍍層，通常出現(xiàn)孔徑兩端之銅層過厚但中心銅層不足的現(xiàn)象。該鍍層不均勻的情況將影響電流輸送的效果，直接導(dǎo)致產(chǎn)品質(zhì)量的不良。為了平衡在表面，特別在孔和微孔中的銅的厚度，迫使降低電流密度，但是這樣會延長電鍍時間到不可接受的地步。隨著反向脈沖電鍍工藝和適合于電鍍工藝的化學添加劑的開發(fā)，縮短電鍍時間成為了現(xiàn)實，這些問題都可由反向脈沖電鍍工藝來克服。<\/strong><\/span><\/span><\/span>\r<\/p>\r \r典型電解工藝：<\/strong><\/span><\/span><\/span>\r<\/p>\r \r電解質(zhì)<\/strong><\/span><\/span><\/span>\r<\/p>\r<\/td>\r \rCuSO4<\/strong><\/span>·<\/strong><\/span>5H2O<\/strong><\/span>：<\/strong><\/span>100-300g/l<\/strong><\/span>、<\/strong><\/span> H2SO4<\/strong><\/span>：<\/strong><\/span>50-150g/l<\/strong><\/span><\/span>\r<\/p>\r<\/td>\r<\/tr>\r \r正向電流密度<\/strong><\/span><\/span><\/span>\r<\/p>\r<\/td>\r \r500-1000A/m2<\/strong><\/span>\r<\/p>\r<\/td>\r \r反向電流密度<\/strong><\/span><\/span><\/span>\r<\/p>\r<\/td>\r \r正向的<\/strong><\/span>3<\/strong><\/span>倍<\/strong><\/span><\/span><\/span>\r<\/p>\r<\/td>\r<\/tr>\r \r電鍍工藝<\/strong><\/span><\/span><\/span>\r<\/p>\r<\/td>\r \r雙向脈沖<\/strong><\/span><\/span><\/span>\r<\/p>\r<\/td>\r \r溫度<\/strong><\/span><\/span><\/span>\r<\/p>\r<\/td>\r \r20-70<\/strong><\/span>℃<\/strong><\/span><\/span><\/span>\r<\/p>\r<\/td>\r<\/tr>\r \r正向時間<\/strong><\/span><\/span><\/span>\r<\/p>\r<\/td>\r \r19ms<\/strong><\/span>\r<\/p>\r<\/td>\r \r反向時間<\/strong><\/span><\/span><\/span>\r<\/p>\r<\/td>\r \r1ms<\/strong><\/span>\r<\/p>\r<\/td>\r<\/tr>\r \r壽命要求<\/strong><\/span><\/span><\/span>\r<\/p>\r<\/td>\r \r50000kA<\/strong><\/span>·<\/strong><\/span>h<\/strong><\/span><\/span>\r<\/p>\r<\/td>\r \r陽極類型<\/strong><\/span><\/span><\/span>\r<\/p>\r<\/td>\r \r專用銥系鈦陽極<\/strong><\/span><\/span><\/span>\r<\/p>\r<\/td>\r<\/tr>\r<\/tbody>\r<\/table>\r \r<\/span>\r<\/p>\r \r2<\/strong><\/span>．<\/strong><\/span>PCB<\/strong><\/span>垂直連續(xù)直流鍍銅<\/strong><\/span><\/span><\/span>\r<\/p>\r \r在<\/strong><\/span>PCB<\/strong><\/span>垂直連續(xù)直流鍍銅工藝中，加入特殊的有機添加劑以促使得到細小晶粒的金屬沉積層和板面均勻分布。這些添加劑必須維持在**的濃度才可以發(fā)揮其**的功用并得到**的產(chǎn)品品質(zhì)。<\/strong><\/span><\/span><\/span>\r<\/p>\r \r這就要求陽極既要能滿足壽命要求，又要對有機添加劑的消耗量盡量少，以減少藥劑消耗成本。而傳統(tǒng)銥系鈦陽極雖然使用壽命都能達到要求，但是光亮劑的消耗很大。金智誠對傳統(tǒng)銥系鈦陽極的工藝和配方進行了改進，開發(fā)出有機添加劑消耗速度大幅降低的專用陽極，接近于可溶性陽極；同時使用壽命也能達到要求。<\/strong><\/span><\/span><\/span>\r<\/p>\r \r典型電解工藝：<\/strong><\/span><\/span><\/span>\r<\/p>\r \r電解質(zhì)<\/strong><\/span><\/span><\/span>\r<\/p>\r<\/td>\r \rCuO<\/strong><\/span>：<\/strong><\/span>60-120g/l<\/strong><\/span>、<\/strong><\/span>H2SO4<\/strong><\/span>：<\/strong><\/span>50-100g/l<\/strong><\/span>、<\/strong><\/span>Cl-<\/strong><\/span>：<\/strong><\/span>40-55ppm<\/strong><\/span><\/span>\r<\/p>\r<\/td>\r<\/tr>\r \r電流密度<\/strong><\/span><\/span><\/span>\r<\/p>\r<\/td>\r \r |
