| 線(xiàn)路板軟板UL認(rèn)證，UL認(rèn)證測(cè)試要求 |
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| 最少起訂量：1件 | 發(fā)貨地：本地至全國(guó) | |
| 上架時(shí)間：2017-09-28 14:46:20 | 瀏覽量：72 | |
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| 所屬行業(yè)：認(rèn)證服務(wù) | 主要客戶(hù)：蘇州 | |
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| 聯(lián)系人:陶靜 (小姐) | 手機(jī):13913142465 |
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| 郵箱:sunny.tao@ycct.com.cn | 地址:獅山路75號(hào) |
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(一) FR-4,FR-4.1,FR-5單面板及雙面板認(rèn)證申請(qǐng) (二) cem-1,cem-3單面板及雙面板申請(qǐng) (三) FR-1,FR-3單面板及雙面板申請(qǐng) (四) FR-4多層板申請(qǐng) (五) 單面鋁基板僅燃燒認(rèn)證和全認(rèn)證申請(qǐng) (六) 雙面鋁基板僅燃燒認(rèn)證和全認(rèn)證申請(qǐng) (七) 多層鋁基板僅燃燒認(rèn)證和全認(rèn)證申請(qǐng) (八) 銅基板 單面,雙面,多層 僅燃燒認(rèn)證和全認(rèn)證申請(qǐng) (九) 柔性線(xiàn)路板(軟板)僅燃燒認(rèn)證和全認(rèn)證申請(qǐng) (十) 軟硬結(jié)合板僅燃燒認(rèn)證和全認(rèn)證申請(qǐng) (十一) 線(xiàn)路板基材認(rèn)證申請(qǐng) (十二) 線(xiàn)路板油墨認(rèn)證申請(qǐng) (十三) 覆蓋膜,電磁膜,屏蔽膜認(rèn)證申請(qǐng) (十四) 已有UL,增加CUL認(rèn)證申請(qǐng) (十五) 其他認(rèn)證申請(qǐng) (十六) XPC板材 22f板材 HB板材 V0板材 1 Scope 1.1 These requirements apply to rigid printed-wiring boards and flexible printed-wiring board for use as components in devices or appliances. Compliance with these requirements does not indicate that the product is acceptable for use as a component of an end product without further investigation. 1.2 The flexible printed-wiring boards covered by these requirements consist of conductors affixed to insulating base film, with or without a cover-lay film, with midboard connections. 1.3 These requirements do not cover flexible printed-wiring boards of laminated-film construction in which the conductors are parallel to each other and are completely covered by the base film with only point-to-point end connections. 1.4 These requirements do not apply to flexible, flex-to-install, rigid, and multilayer rigid flex composite interconnect constructions with and without stiffener and adhesive materials as flexible materials interconnect constructions (FMIC's) for use as components in devices or appliances – that are covered by the Standard for Flexible Materials Interconnect Constructions, UL 796F. Cover Transmittal Table of Contents Body INTRODUCTION 1 Scope 2 Glossary 3 Units of Measurement 4 Measurement Accuracy and Testing Conditions 5 Supplementary Test Procedures 6 References 7 General CONSTRUCTION 8 General 9 Base Materials 10 Conductors 11 Adhesives for Conductor Bonding 12 Processes 13 Permanent Coatings 14 Plugged-Hole Materials 15 Embedded Components 16 Singlelayer (Singlesided and doublesided) Printed-Wiring Boards 17 Multilayer Printed-Wiring Boards 18 Metal Base Printed-Wiring Boards 19 Flexible Printed-Wiring Boards 20 Variations In Printed-Wiring Board Construction PERFORMANCE 21 Test Samples 22 Data Collection 23 Microsection Analysis 24 Thermal Shock 25 Flammability 26 Bond Strength 27 Delamination and Blistering 28 Dissimilar Dielectric Materials Thermal Cycling Test 29 Plating Adhesion 30 Conductive Paste Adhesion Test 31 Dielectric Materials Intended for Use in Fabricating High Density Interconnect (HDI) Type Constructions 32 Silver Migration Test MARKINGS 33 General FOLLOW-UP INSPECTION 詳詢(xún)Sunny 陶13913142465 |
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