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代理韓國(guó)UV膜玻璃/晶圓切割300mm*100m 無(wú)殘膠無(wú)飛料

	價(jià)格：1 元(人民幣)	產(chǎn)地：深圳
	最少起訂量：1平方米	發(fā)貨地：深圳
	上架時(shí)間：2017-09-01 16:32:40	瀏覽量：1452
	深圳市邦凱膠粘制品有限公司
	經(jīng)營(yíng)模式：生產(chǎn)加工	公司類型：私營(yíng)獨(dú)資企業(yè)
	所屬行業(yè)：輔助包裝材料、輔助包裝物	主要客戶：高分子膠帶、電子應(yīng)用材料的生產(chǎn)、銷售與研發(fā)
	在線咨詢

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聯(lián)系人:康久烽 (先生)	手機(jī):13802575882
電話:	傳真:
郵箱:407055980@qq.com	地址:松崗溪頭路35號(hào)

詳細(xì)介紹

加工定制	是	厚度	0.17	適用范圍	玻璃切割晶圓切割
用途	玻璃保護(hù)膜	品牌	邦凱	材質(zhì)	PO
長(zhǎng)度	200m	基材	PO	膠系	亞克力
寬度	1200mm	顏色	半透明	系列	UV膜
訂貨號(hào)	29909571	粘性	強(qiáng)	卷芯材質(zhì)	PE
型號(hào)	BK-HG3810	是否跨境出口貨源	否

顏色：透明	基材：pet/po	厚度：0.17（mm）
延伸系數(shù)：100%	短期耐溫性：NA（℃）	加工定制：是
寬度：180/210/230/300/330（mm）	膠系：亞克力	長(zhǎng)期耐溫性：NA（℃）
型號(hào)：BK-78315	適用范圍：玻璃切割晶圓切割	品牌：LINTEC

我公司專業(yè)代理琳得科ADWILL D系列UV膜，用于玻璃，晶圓，基板，陶瓷片等產(chǎn)品的切割。產(chǎn)品線齊全，價(jià)格優(yōu)勢(shì)，歡迎來(lái)電咨詢。

Two types of back grinding tape are available. The "E series" which can be removed without placing stress on the wafer by decreasing adhesion by UV irradiation, and the "P series" which is non-UV type. In addition, there is the "S series" peeling tape.

D series (UV Curable Dicing Tape)

Product Information

Si Wafer Base Material:PVC-PO	High Expandability Antistatic Anti-chipping High Adhesion Easy Pick Up
Glass / Ceramics Base Material:PVC-PET	Standard
Package Substrate Base Material:PO	Standard Antistatic
Stealth Dicing Base Material:PVC-PO	Standard
Wafer with LC Tape Base Material:PO	Standard

Adwill D series is an epoch-making line of UV curable dicing tapes whose features can be changed in accordance with operational process. The tape's strong adhesion secures wafers during dicing, and then is reduced by UV irradiation to facilitate pick-up. This dicing tape is essential for full-cut dicing of wafers to improve die quality, and fully applicable to dies of multiple sizes.

Secures wafers with strong initial adhesion to ensure dicing without any slipping or peeling even for small dies.
Supports instant control of adhesion by UV irradiation, allowing large dies to be picked up easily.
Causes no contamination by metal ions or by adhesive residue on the wafer backside surface, and no adverse UV irradiation effects on ICs.
Prevents contact damage of dies with superb expandability, which is not reduced by UV irradiation.
Offers a variety of tape grades ranging from a tape with reduced tape chips at high speed, full-cut dicing to a special tape for thin wafers.
Provides special grades not only for wafer dicing but also for package, ceramic or glass dicing.
Provides various not only for blade dicing but also for laser dicing.
Supports the adhesive coating process environment that meets Class 100 (ANSI 209b) standards.

ount tape Adwill D-series specification

Name of tape	D-105V	D-203	D-210	D-218	D-410T	D-510T	D-511T	D-628	D-636	D-636 (LM001B)	D-650	D-667	D-670	D-675	D-820
Tape thickness (um)	90	65	125	203	130	170	170	90	155	95	90	90	90	90	110
Face material / Thickness (um)	PVC / 80	PET / 50	PET / 100	PET / 188	PO / 100	PO / 140	PO / 140	PO / 80	PO / 140	PO / 80	PO / 80	PO / 80	PO / 80	PO / 80	PVC / 100
Color	Blue	Transparent	Transparent	Transparent	Clear	Clear	Clear	Clear	Clear	Clear	Clear	Transparency	Clear	Clear	Blue
Adhesive layer / Thickness (um)	Acrylic / 10	Acrylic / 15	Acrylic / 25	Acrylic / 15	Acrylic / 30	Acrylic / 30	Acrylic / 30	Acrylic / 10	Acrylic / 15	Acrylic / 15	Acrylic / 10	Acrylic / 10	Acrylic / 10	Acrylic / 10	Acrylic / 10
Before UV adhesion (g/inch)	400	2000	2000	1600	2000	2300	1200	1000	1400	1200	350	400	400	200	340
After UV adhesion (g/inch)	35	15	20	25	70	80	30	10	65	100	10	60	60	20	75
Holding power (sec.)	10000	3000	50000	3000	50000	50000	>70000	>70000	50000	50000	>70000	>70000	>70000	>70000	>70000
25% strength MD (kg/cm)	0.8	6	12	>15	1	1.25	1.25	0.8	1.25	0.8	0.8	0.8	0.8	0.8	0.7
25% strength CD (kg/cm)	0.7	6	12	>15	0.9	1.2	1.2	0.7	1.2	0.7	0.7	0.7	0.7	0.7	0.6
Tensile strength MD (kg/cm2)	285	1500	2000	>1000	320	350	350	340	350	320	340	340	340	340	250
Tensile strength CD (kg/cm2)	225	1500	2000	>1000	260	340	340	280	340	270	280	280	280	280	200
Elongation MD (%)	295	120	100	>50	480	570	570	450	570	450	450	450	450	450	300
Elongation CD (%)	285	120	100	>50	530	620	620	500	620	500	500	500	500	500	200
Expandability	Excellent	No good	No good	No good	No good	No good	No good	No good	No good	Fair	No good	Fair	Fair	Good	Excellent
Suitable chip size	>2X2mm	>1X1mm	>1X1mm	>1X1mm	>0.5X0.5mm	>0.5X0.5mm	>0.5X0.5mm	>0.5X0.5mm	>0.5X0.5mm	>0.5X0.5mm	>1X1mm	>1X1mm	>1X1mm	>2X2mm	>2X2mm
Guarantee period (Mon.)	4	6	6	6	5	5	5	5	5	5	8	5	5	5	2
Remark	Expandable tape	For glass & ceramic dicing	For glass & ceramic dicing	For glass & ceramic dicing	For package dicing (CSP, BGA)	For package dicing (CSP, BGA)	For package dicing (CSP, BGA)	For small chip dicing	For small chip dicing	For small chip dicing	For LOC package, Low adhesive residue	Standard dicing tape	Standard dicing tape	Standard dicing tape	Anti-static dicing tape

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